Scanning Electron Microscopy (SEM) combined with Energy Dispersive X-ray Spectroscopy (EDX) provides detailed surface imaging and elemental analysis for electronic components, printed circuit boards and materials. This powerful combination helps identify unknown materials, investigate failures and verify manufacturing quality.
When conventional inspection methods cannot provide sufficient information, SEM and EDX offer a much deeper level of investigation.
SEM produces extremely high-resolution images of surfaces and microstructures, while EDX identifies the elemental composition of materials. Together they provide valuable insight into manufacturing defects, contamination, corrosion, coating quality and failure mechanisms.
Whether you are investigating a product failure, verifying a material or supporting a customer complaint, SEM & EDX analysis delivers objective technical evidence.
SEM & EDX analysis is recommended when:



