Cross-section analysis
Gain insight into internal structures of PCBs and electronic assemblies — from layer build-up to manufacturing quality
We analyze internal structures of PCBs and assembled electronics to identify defects, verify layer build-up, and assess manufacturing quality.
Defects inside PCBs and assemblies are often invisible — until they cause failures
Internal defects in layers, vias, solder joints, or materials are often invisible from the outside and only become apparent after failures occur.
When Should You Contact ETECH?
- Internal PCB or assembly defects are suspected
- Solder joint or via reliability is unclear
- Layer build-up needs verification
- Assembly quality issues cannot be explained
- Field failures require deeper analysis
- New PCB designs need validation
- Supplier quality needs verification
Why manufacturers choose ETECH
We combine cross-section analysis, IPC expertise, and manufacturing knowledge to provide insight into internal quality of PCBs and assemblies.
- Independent analysis — no production bias
- Detailed inspection of internal PCB and assembly structures
- Fast response — clear next steps within 24 hours
- Practical reports you can act on