When electronic products fail, identifying the true root cause is essential to prevent recurring issues and improve product reliability.

ETECH Technology Center provides independent failure analysis services for printed circuit boards (PCBs), PCB assemblies (PCBAs), cables, wire harnesses and electronic components. Using a combination of visual inspection, microscopy, X-ray analysis, cross-sectioning, measurement techniques and industry standards, we help manufacturers understand why failures occur.

Whether the issue is related to manufacturing defects, material problems, design weaknesses, assembly processes or field failures, our specialists deliver clear technical findings and practical recommendations.

Typical applications:

• Field failure investigations
• Manufacturing defect analysis
• Supplier quality verification
• Reliability assessments
• Root cause investigations
• Corrective action support

Microsection analysis provides a unique insight into the internal construction and manufacturing quality of printed circuit boards. By preparing precision cross-sections and examining them under high-magnification microscopy, critical characteristics can be evaluated that are otherwise impossible to inspect.

ETECH Technology Center performs cross-section analysis in accordance with IPC standards to assess copper plating thickness, layer structure, via integrity, laminate quality and manufacturing workmanship. This service is frequently used for quality verification, supplier qualification, reliability investigations and failure analysis.

Our laboratory can evaluate both bare printed circuit boards and assembled electronic products.

Typical applications:

• PCB quality verification
• Copper plating thickness measurements
• Via and hole wall analysis
• Layer structure evaluation
• Supplier qualification
• Failure analysis support