Price List

179,22

Microsection Services

1 micro section
  • Microsectioning according to IPC-TM-650 and IPC-9241
  • Sample registration, preparation, grinding and polishing
  • Optical microscopic inspection
  • High-resolution digital micrographs
  • Reporting not included (basic or extended report optional)
261,62

Microsection Services

2 micro sections
  • Microsectioning according to IPC-TM-650 and IPC-9241
  • Sample registration, preparation, grinding and polishing
  • Optical microscopic inspection
  • High-resolution digital micrographs
  • Reporting not included (basic or extended report optional)
328,57

Microsection Services

3 micro sections
  • Microsectioning according to IPC-TM-650 and IPC-9241
  • Sample registration, preparation, grinding and polishing
  • Optical microscopic inspection
  • High-resolution digital micrographs
  • Reporting not included (basic or extended report optional)
390,37

Microsection Services

4 micro sections
  • Microsectioning according to IPC-TM-650 and IPC-9241
  • Sample registration, preparation, grinding and polishing
  • Optical microscopic inspection
  • High-resolution digital micrographs
  • Reporting not included (basic or extended report optional)
222,95

Microsection Services

Microsection Basic Report
  • Documentation of results
  • Selected high-resolution micrographs
  • Identification of inspected features and section locations
  • No conclusions or technical interpretation
  • No pass/fail or IPC class assessment
602,55

Microsection Services

Microsection Extended Report
  • Documentation of results
  • Comprehensive high-resolution micrographs
  • Identification of inspected features and section locations
  • Technical interpretation and conclusions
  • Pass/fail and IPC class assessment (where applicable)
485,04

Visual Inspection

IPC-A-600 (Bare PCBs)
  • Visual inspection of bare PCBs according to IPC-A-600
  • Evaluation of external visible board features
  • Assessment against IPC Class 1 / 2 / 3
  • Optical magnification used where required
  • Basic inspection results documented
485,04

Visual Inspection

IPC-A-610 (Electronic Assemblies)
  • Visual inspection of assemblies according to IPC-A-610
  • Evaluation of solder joints and components
  • Assessment against IPC Class 1 / 2 / 3
  • Optical magnification used where required
  • Basic inspection results documented
485,04

Visual Inspection

IPC/WHMA-A-620 (Cable & Wire Harnesses)
  • Visual inspection according to IPC/WHMA-A-620
  • Evaluation of crimps, terminations and solder joints
  • Assessment against IPC Class 1 / 2 / 3
  • Inspection of insulation and strain relief
  • Basic inspection results documented
On request
0,00

Solderability Testing

Components (J-STD-002)
  • Solderability testing according to J-STD-002
  • Testing of leaded (THT) components
  • Testing of surface mounted (SMD) components
  • Evaluation of wetting, dewetting and non-wetting
  • Reporting with results (conclusions optional)
On request
0,00

Solderability Testing

Printed Circuit Boards (J-STD-003)
  • Solderability testing according to J-STD-003
  • Evaluation of plated through holes (THT)
  • Evaluation of solder pads for SMD components
  • Assessment of solderability performance
  • Reporting with results (conclusions optional)
On request
0,00

Thermal Imaging Analysis

Thermal Imaging Analysis
  • Thermal imaging using infrared camera
  • Identification of hotspots and temperature gradients
  • Analysis under operational conditions
  • Interpretation of thermal behavior
  • Report with results
164,80

XRF Surface Finish Measurement

XRF Surface Finish Measurement
  • XRF surface finish measurement
  • Determination of coating thickness and composition
  • Up to 3 measurements per PCB
  • Short analysis report included
  • Suitable for incoming inspection and verification
On request
0,00

Incoming Inspection Services

Incoming Inspection Services
  • Incoming inspection of PCBs, assemblies or cable harnesses
  • Visual inspection according to applicable IPC standards
  • Verification against customer-specific criteria
  • Optical magnification used where required
  • Basic documented inspection results
On request
0,00

Failure Analysis Support

Failure Analysis Support
  • Failure analysis support based on laboratory investigation
  • Combination of visual inspection, X-ray and microsectioning
  • Identification of failure mechanisms
  • Technical interpretation of findings
  • Reporting with results and conclusions